XS156 Heat Management

one of two solutions below is required for an xs156 to manage thermal dissipation and proper operation an optional finned heatsink, purchased from brightsign, can be affixed to the top of the aluminum slug as shown below the height of the optional heatsink from pcb to the top is 14 25mm see image 1 an enclosure design which bonds the aluminum slug to an aluminum plate that is at least 2mm thick and 80mm x 80mm wide see image 2 these units come with a thick thermal pad which adheres to a piece of aluminum to dissipate heat the blue or clear protective plastic should be removed prior to installation if the unit will not be installed in a thermally bonded case, the optional heatsink must be purchased, and the protective plastic on the (thinner) thermal pad on that heatsink kit must also be removed before installation, the thicker default pad on the brightsign built in must be removed (only the thinner thermal pad should be used) also note that the thermal pad under the aluminum slug is not visible to the user the aluminum plate must be mounted in such a way as to create a tight thermal bond with the thermal pad, so heat is efficiently transferred from the soc through the heat slug, pad an into the aluminum plate final solutions should be verified in a temperature controlled test chamber to ensure the thermal design is effective components are mounted on both sides of the pcb ensure that at least 2 45mm clearance is available below the bottom side of the pcb and at least 18 5mm clearance is available above the top depending on the chosen thermal solution and ventilation considerations